FL901S
Product Description
Master Bond FL901S is a high performance silver filled epoxy based film which offers outstanding performance properties combined with easy handling, simple processing and convenient storage stability. Unlike most electrically conductive film systems, FL901S does not require freezing, and simple refrigeration is fine. Its physical properties are particularly appealing. It bonds well to a wide variety of substrates including metals, composites, glass, ceramics, many rubbers and plastics. It has exceptional capabilities of withstanding aggressive thermal cycling as well as thermal and mechanical shocks. FL901S has good chemical resistance especially to oils, water, etc. Its cure is straightforward and to the point, 1 hour at 250°F or 40-45 minutes at 300°F. Its service temperature range is highly commendable at -100°F to +500°F and, of course, it has extraordinary electrical conductivity; the volume resistivity being less than 1 milliohm-cm.
Master Bond FL901S is available in two standard sizes. The first is 6″ long x 2″ wide x 0.003″ thick. The second size is 8″ long x 4.3″ wide x 0.003″ thick. Most importantly, other sheet sizes are available as well, or it can be cut into various dimensions.
Since it contains silver, it is a superb thermal conductor. FL901S cures in a manner that ensures uniform bond line thicknesses. FL901S can be used in a wide array of electronic applications for bonding, sealing and coating. It has even been used for EMI/RFI shielding. In actuality, FL901S’ versatility enables it to be used in many specialty applications where easy processing, electrical conductivity and remarkable physical characteristics are desirable.
Product Advantages
- Film system, no mixing required.
- Simple heat curing at 250-300°F
- Available in convenient shapes and sizes; specialty preforms are available
- Exemplary thermal cycling capabilities
- Dependable adhesion to a wide variety of substrates
Packaging
Film
FL901S is available is various sizes and units to accommodate customer’s needs
