FL901AO
Product Description
Master Bond FL901AO is a high performance thermally conductive, electrically insulating epoxy based film system. It has outstanding performance properties combined with easy handling and convenient storage stability. Its physical properties are particularly robust. It has excellent adhesion to a wide variety of substrates including metals, composites, glass, ceramics, many rubbers and plastics. It has good chemical resistance to oils, water, etc. FL901AO is particularly noteworthy for its simple processing; that is oven curing for 1 hour at 250°F or 40-45 minutes at 300°F. Its service temperature range is very attractive, -100°F to +400°F. Most importantly, it combines thermal conductivity with sterling electrical insulation properties. The standard size is 6″ x 2″ x 0.003″; although, other sheet sizes are available. It should be noted that special preforms can also be prepared. One of the main reasons for using this film is to obtain uniform bond line thicknesses. FL901AO can be used in a wide array of aerospace, electronic, electrical and specialty OEM applications where thermal conduction, electrical insulation and marvelous physical properties are desirable.
Product Advantages
- Film system, no mixing required. Provides for uniform bond line thicknesses
- Simple heat curing at 250-300°F
- Superior thermal conduction along with compelling electrical resistance
- Available in convenient shapes and sizes; specialty preforms are available
- Impressive thermal cycling capabilities
- Reliable adhesion to a wide variety of substrates
Packaging
Film
Preforms
FL901AO is available is various sizes and units to accommodate customer’s needs
