UV22DC80
Product Description
Master Bond UV22DC80 is a nanosilica filled, dual cure epoxy based system. It is formulated to cure readily upon exposure to UV light and most importantly it will crosslink in shadowed out areas with the addition of heat. The logic in developing this kind of product is that UV curables will crosslink rapidly and thoroughly upon exposure to the light, but it will not cure in areas where the material is not exposed to the light. Having a dual cure mechanism allows those areas not exposed to the light being curable with the addition of heat. The thermal part of the cure is achieved at a user friendly 80°C (particularly when working with plastics). Dual cure systems are particularly useful for rapidly fixturing parts with the UV portion of the cure and then finishing the process by heating.
This lower viscosity system features a cationic cure mechanism (for the UV portion). This combined with being a nano filled system confers an exceptionally low shrinkage and outstanding dimensional stability. UV22DC80 is not oxygen inhibited. After polymerizing it has many advantageous properties. It bonds well to a wide variety of substrates including metals, glass, ceramics and most plastics. UV22DC80 has very good chemical resistance to many acids, bases, fuels and solvents. It is a superb electrical insulator, also it is able to withstand rigorous thermal cycling. The service temperature range is -60°F to +350°F.
Straight UV curing can be accomplished for thicknesses of 0.010″ to 0.020″ in seconds using UV light at 365 nm with 20-40 milliwatts/cm2 of energy. Faster cures can be achieved at higher energy outputs. Areas not cured because of shadowing can be cured at 80°C for 40-60 minutes. In addition, post curing at 125-150°C for 15-30 minutes can increase the Tg from 90°C achieved by straight UV curing to over 125°C. The combination of an 80°C secondary cure and the presence of a nano filler confers very special properties to this compound. The ability to initiate curing with a UV light source and complete it with heat opens new horizons for the use of UV22DC80 in high tech applications particularly in aerospace, optical and optoelectronics, among others.
Product Advantages
- One component system; no mixing needed
- Dual curing mechanism allows for curing in shadowed out areas and rapid fixturing time at 80°C
- No oxygen inhibition
- Bonds well to a wide variety of substrates
- Excellent physical strength properties
- Nano filled, high dimensional stability
Packaging
Can
Pail
UV22DC80 is available is various sizes and units to accommodate customer’s needs
