SB31

硕士邦德Speed​​bond 31是一个额外的快速固化，无混合高性能增韧丙烯酸粘合剂系统，提供卓越的易用性非常高的应用和粘接强度，对金属，陶瓷，玻璃，木材，大多数塑料和橡胶。 这种独特的产品包括一个低粘度液体活化剂和树脂基胶粘剂。 没有必要事先混合使用。 对于粘接，活化剂应用到一个或将要加入的表面都让约2分钟干燥。 粘合剂树脂，然后应用到表面要么被加入和被粘接部件组装。 只有足够的接触压力，以保持其应有的位置，零件在组装过程中需要进行应用开发的实力，直到处理。 这种独特的聚合物系统可用于在极宽的温度范围-60至+250 ° F。 实力是取得了惊人的处理速度快，通常在不到3分钟，时间上要加入的表面和缝隙的宽度而定​​。 对于许多密切配合面处理强度可在不到1分钟。 达到最大粘接强度在6小时以内。 快速提供高剪切强度以及优异的影响和冲击阻力硕士邦德Speed​​bond 31胶粘剂粘接系统优化了许多艰难的操作，提高工作效率并减少在生产作业中，不仅而且在零部件的保税货物，在实际服务的故障。 硕士邦德Speed​​bond 31提供优良的粘接强度，以不同的金属和塑料基板很大的数目。 与大多数其他粘合剂，其性能相对不敏感基板清洗程序。 在许多情况下可以得到足够的附着力甚至油性金属表面。 为了达到最佳强度适当的基板清洗建议。 下表总结了硕士邦德的突出特点Speed​​bond 31胶系统。 对环境温度，没有混合治疗和可靠的本系统的高性能胶粘剂方便有保障，在电子，电气，计算机，金属加工，家电和航空航天等行业的广泛使用。 主键Speed​​bond 31系统是100％反应，不含有任何溶剂或稀释剂。

Master Bond Speedbond 31 is an extra-fast curing, no-mix high performance toughened acrylic adhesive system offering exceptional ease of application and remarkably high bonding strength to metals, ceramics, glass, wood, most plastics and rubbers. This unique product comprises a low viscosity liquid activator and the base adhesive resin. No mixing is necessary prior to use. For bonding, the activator is applied to one or both of the surfaces to be joined and let dry for approximately 2 minutes. The adhesive resin is then applied to either of the surfaces to be joined and the parts to be bonded are assembled. Only contact pressure sufficient to maintain the parts in their proper position need be applied during assembly until handling strength is developed. This unique polymer system can be used over the exceptionally wide temperature range of -60 to +250°F. Handling strength is achieved surprisingly fast usually within less than 3 minutes, the time depending on the surfaces to be joined and the gap width. For many closely fitting surfaces handling strength can be obtained within less than 1 minute. Maximum bonding strength is achieved within 6 hours or less. Rapidly providing high shear strength as well as superior impact and shock resistance Master Bond Speedbond 31 adhesive system optimizes many difficult bonding operations, enhances productivity and reduces failures not only during manufacturing operations but also during shipment of bonded parts and in actual services. Master Bond Speedbond 31 offers excellent bonding strength to a great number of different metal and plastic substrates. Unlike most other adhesives, its performance is relatively insensitive to substrate cleaning procedures. In many cases adequate adhesion can be obtained even to oily metal surfaces. For optimal strength proper substrate cleaning is recommended. The table below summarizes the outstanding characteristics of the Master Bond Speedbond 31 adhesive system. The convenience of an ambient temperature, no-mix cure and the reliable high performance of this adhesive system have assured its wide usage in the electronic, electrical, computer, metalworking, appliance and aerospace industries. The Master Bond Speedbond 31 system is 100% reactive and does not contain any solvents or diluents.