MS705

MS705 Master Bond, Inc.

硕士邦德MasterSil 705C是一种易于使用的,一个组件,导电碳填充的硅胶粘接和密封。 该材料是一种黑色的油膏。 它很容易在室温下暴露于大气中的水分,是一个无腐蚀型硅胶固化。 MasterSil 705C适度低电阻特性,是许多粘接和屏蔽型应用的理想选择。 这是维修过的宽温度范围-75 ° F至+400 ° F。 MasterSil 705C是一个符合成本效益的替代较昂贵的MasterSil 705S(银满),特别是在只需要适度的低电阻的应用。

Master Bond MasterSil 705C is an easy-to-use, one component, electrically conductive, carbon filled silicone for bonding and sealing. The material is a black colored paste. It cures readily at ambient temperatures when exposed to atmospheric moisture and is a non-corrosive type silicone. MasterSil 705C features moderately low resistance and is ideal for many bonding and shielding type applications. It is serviceable over the wide temperature range of -75°F to +400°F. MasterSil 705C is a cost effective alternative to the more expensive MasterSil 705S (silver filled) particularly in applications where only moderately low resistance is needed.

技术参数/Specifications

Chemical System Silicone
Composition Unfilled
Cure / Technology Thermoset; Single Component; Room Temperature Vulcanizing or Curing
Features Non-corrosive; Sealant
Industry Sanitary; Military

MS705,硕士邦德公司,热固性粘合剂,MS705, Master Bond, Inc., Thermoset Adhesives


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