MS157

MS157 Master Bond, Inc.

主银157是一种自吸冷凝固化硅系统,在加入固化剂在室温下树脂将形成坚韧,弹性硅橡胶灌封和封装化合物以及卓越的粘合系统。 主银157是用于电压调节器,电源,高电压变压器,连接器背面填充,印刷电路板组件的装配以及其他各种电子应用极大封装。 它的“体力和电气绝缘性能独特的混合提供保护敏感的电子元件和灰尘,潮湿,臭氧,热冲击和振动组件。 主银157也构成了对传统的有机硅RTV粘合剂的一部分,特别是在深部固化需快速固化密封剂的替代。

Master Sil 157 is a condensation cured self priming silicone system which, upon adding curing agent to resin at room temperature will form a tough, resilient silicone rubber potting and encapsulation compound as well as a superior adhesive system. Master Sil 157 is used for encapsulation of voltage regulators, power supplies, high voltage transformers, connector back fills, PCB component assemblies as well as a great variety of other electronic applications. Its’ unique blend of physical strength and electrical insulation properties offers protection to sensitive electronic components and assemblies from dust, moisture, ozone, thermal shock and vibration. Master Sil 157 also constitutes a fast curing alternative to conventional one part silicone RTV adhesive sealants especially where deep section cures are required.

技术参数/Specifications

Compound Type Encapsulant, Potting Compound; Sealant; Adhesive
Type / Form Liquid
Composition Unfilled
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing

MS157,硕士邦德公司,有机硅胶粘剂及密封剂,MS157, Master Bond, Inc., Silicone Adhesives and Sealants


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