MS151

MS151 Master Bond, Inc.

硕士邦德MasterSil 151是一种双组分低粘度高性能浇铸,灌封和封装有机硅化合物。 该基地后,在常温固化的液体或在一个坚韧,灵活,光学透明硅橡胶高温下更快速固化剂除低粘度树脂。 这种硅橡胶复合粘度低保证填写完整的解决复杂的轮廓,即使在非常复杂的配置,并提供优良的电绝缘性以及卓越的抗震动和冲击后治愈。 它已被广泛接受的灌封的电子元器件,电子设备和各种光学系统,以及为太阳能电池和光纤或任何一个艰难的,有弹性,光学透明保护免受不利环境条​​件的要求涂层封装。

Master Bond MasterSil 151 is a two component low viscosity silicone compound for high performance casting, potting and encapsulation. The base low viscosity resin after the addition of a liquid curing agent cures at ambient or more quickly at elevated temperatures to a tough, flexible, optically clear silicone rubber. The low viscosity of this silicone elastomer compound assures complete fill-in around complicated contours in even very complex configurations and provides excellent electrical insulation as well as superior resistance to vibration and shock after cure. It has been widely accepted for potting and encapsulation of electronic components, electrical devices and various optical systems as well as a coating for solar cell and fiber optic or wherever a tough, elastic and optically transparent protection against adverse environmental conditions is required.

技术参数/Specifications

Chemical System Silicone
Type / Form Liquid
Composition Unfilled
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Features Encapsulant, Potting Compound; Sealant
Industry Electronics

MS151,硕士邦德公司,热固性粘合剂,MS151, Master Bond, Inc., Thermoset Adhesives


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