EP21TCHT-1是一种双组分触变浆料，适用于粘接和密封. 该系统已在涉及不同基材、使用条件和要求的各种应用中得到应用。佛罗里达大学发表多篇研究论文，普林斯顿大学(Princeton University)和美国国家航空航天局(NASA)等机构参考了Master Bond EP21TCHT-1的使用方法。这种耐热环氧树脂可在温度范围为4K到+400°F时使用，并在低温条件下保持其性能。该室温固化剂具有导热性和电绝缘性。EP21TCHT-1通过了NASA的低排气测试，因此建议在真空环境中使用。以下是EP21TCHT-1在研究实验室和商业应用中有效使用的多种方式的总结。
| 应用 | 基材 | Conditions/Requirements |
| Magnet bonding and potting1磁铁粘合 和灌封 | Sm-Co magnets 钐钴磁铁 | Low outgassing, low CTE, high strength, and ability to be used at cryogenic temperatures.
低排气，低CTE，高强度，能在低温下使用 |
| Sister-block bonding for a telescope2 | SiC
|
Low outgassing, low CTE, high strength, and ability to be used at cryogenic temperatures.
低排气，低CTE，高强度，能在低温下使用。 |
| Mounting gratings for a telescope3
安装望远镜的光栅 |
Silicon; titanium alloy; invar
硅;钛合金;不胀钢 |
Operational temperature of 200K
工作温度200K |
| Laser packaging assembly
激光包装组装 |
Glass; Si wafers with gold metallization
玻璃;经过镀金处理的硅晶圆 |
4K to 400°F service temperature range
工作温度范围为4K到400°F |
| Wire bonding in micro sensor packaging5
微传感器封装中的线连接 |
Gold; TO-39 header
|
|
Mirror coating6
|
Mirror
|
NASA low outgassing; used in environments of 10-9 torr
NASA 低释气 ，使用于10-9 真空中 |
| Teflon wire coated with epoxy; used to secure the wire tie downs to the structure7
涂有环氧树脂的聚四氟乙烯线;用于将金属丝固定在结构上 |
Teflon*1 | NASA low outgassing
NASA 低释气 |
| Sealing magnetic field coils8
密封磁场线圈 |
Wrapped fiberglass braid
包装玻璃纤维编织 |
Epoxy is intended to eliminate vacuum leaks
环氧树脂用于消除真空泄漏 |
| Ionizer coating9
离子发生器涂层 |
Ceramic; radioactive silver foil
陶瓷;放射性银箔 |
Low outgassing低释气 |
| Bonding heat dissipation plate to housing wall of laser emitter module10
将散热板粘接在激光发射器模块的外壳壁上 |
Ceramic
|
Electrically insulative, thermally conductive
电绝缘的，导热的 |
| Solar cell package bonding and sealing11
太阳能电池封装封装 |
Solar cell; aluminum
太阳能电池;铝 |
Thermal conductivity
|
| Sealing a probe12
密封探测器 |
Stainless steel
|
NASA low outgassing NASA 低释气 |
| Bonding metal mounting blocks to lenses13
将金属安装块与镜头粘接 |
Fused silica; metal; zinc selenide; calcium fluoride; sapphire
熔融石英;金属;硒化锌;氟化钙;蓝宝石 |
Provided really good bond strength, and broke the substrates in some bond strength tests
提供了非常好的粘结强度， |
| Spectrograph camera assembly: Injected between spider and bushing14
摄谱仪相机组件:注射在支架和衬套之间 |
Optical Lens, ICs, ultem, metals
光学透镜，集成电路，ultem，金属 |
Flow; gap filling; precise alignment
流;填缝;精确的定位 |
| Bonding heat sink components15
焊接散热器组件 |
Copper, aluminum
铜、铝 |
NASA low outgassing NASA 低释气 |
| Sister block bonding for space based gravitational wave detectors16
用于空间引力波探测器的块连接 |
SiC
|
Dimensional stability, bond strength
尺寸稳定性，结合强度 |
佛罗里达大学的教授写了一篇题为《用于空间干涉测量任务的材料的稳定性》的论文。2在这篇论文中讨论的主题之一是氢氧键在空间任务的仪器组装中的应用。构建了激光干涉仪空间天线(LISA)任务的望远镜支撑结构原型。在望远镜制作完成后，人们发现氢氧键支撑是倾斜的。在-70°C的温度下，少量的力就能使支柱脱离。试图提供额外的力量。
在研究了几种不同的环氧化合物后，选择了EP21TCHT-1主粘结剂作为姐妹块粘结剂。它提供了一系列有利的属性，包括：
低释气
快速室温固化
低CTE
高强度
低温性
EP21TCHT-1胶水在室温下固化2天，不做任何表面处理。剪切强度试验表明，与氢氧键合相比，剪切强度有显著提高，证明了ep21tts -1用于键合的适用性。
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http://www.dtic.mil/dtic/tr/fulltext/u2/a522020.pdf
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