EP30AOSP

EP30AOSP Master Bond, Inc.

硕士邦德聚合物系统EP30D – 9是一个独特的versatib双组份,耐磨弹性体具有优越的强度,韧性好,耐高性能粘接,密封,浇铸和封装应用的化学品。 它结合了如强度,耐化学性和品质环氧树脂胶粘剂的认可有利的性能特点,与那些包括聚氨酯的韧性,耐磨性和弹性。 一个特殊的高纯度氧化铝添加到敌对erivironments性能最大化。 硕士邦德聚合物Systenn EP30D – 9配方,在室温下固化,或在高温下更迅速的基础上的一个重100到15的混合比例。 它的无滴功能允许甚至在垂直表面应用。 硕士邦德聚合物系统EP30D – 9是100%反应,不含有任何溶剂或稀释剂。 主键EP30D – 9最小收缩到一个持久的,高强度和良好的耐非常热循环和包括水,无机盐,碱和酸类以及在极宽的温度范围内许多有机化工品坚韧弹性体系统治疗在 – 60 ° F至250 ° F.以上 粘附于金属,混凝土,玻璃,陶瓷,木材,橡胶硫化和许多塑料是非常好的。 固化后的弹性体是一种绝缘体。 部分颜色A是灰色的,B部分为灰色。 硕士邦德聚合物系统EP30D – 9,广泛应用于电子,电气,计算机,金属加工,家电,汽车,都为原始部件和维护/维修化学加工工业。 这是很安全时使用适当的工业卫生习惯得到遵守。

Master Bond Polymer System EP30D-9 is a uniquely versatib two component, abrasion resistant elastomer featuring superior strength, toughness and good resistance to chemicals for high performance bonding, sealing, casting and encapsulation applications. It combines the recognized advantageous performance characteristics of epoxy resins such as strength, chemical resistance and adhesive qualities, with those of the polyurethanes including toughness, abrasion resistance and flexibility. A special high purity aluminum oxide is added to maximize performance in hostile erivironments. Master Bond Polymer Systenn EP30D-9 is formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 15 mix ratio on a weight basis. Its no drip feature permits applications even on vertical surfaces. Master Bond Polymer System EP30D-9 is 100% reactive and does not contain any solvents or diluents. The Master Bond EP30D-9 system cures with minimal shrinkage to a durable, high strength and tough elastomer with remarkably good resistance to thermal cycling and chemicals including water, inorganic salts, alkalis and acids as well as many organic chemicals over the exceptionally wide temperature range of – 60°F to more than 250°F. Adhesion to metals, concrete, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The cured elastomer is an electrical insulator. Color of part A is gray, part B gray. Master Bond Polymer System EP30D-9 is widely used in the electronics, electrical, computer, metalworking, appliance, automotive and chemical process industries both for original components and maintenance/repair. It is quite safe to use when proper industrial hygiene practices are observed.

技术参数/Specifications

Compound Type Adhesive
Type / Form Liquid
Substrate Compatibility Composites; Plastic; Porous Surfaces; Dissimilar Substrates
Cure / Technology Room Temperature Vulcanizing or Curing; Thermoplastic; Two Component  
Features High Dielectric
Industry Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Construction; Semiconductors, IC’s; Tooling; Chemical/Oil Processing, Metal Working

EP30AOSP,硕士邦德公司,聚氨酯胶粘剂及密封剂,EP30AOSP, Master Bond, Inc., Polyurethane Adhesives and Sealants


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