Manual polishing machine for semiconductor material, geeignet für Wafer bis zu 6″ Durchmesser..半导体材料手工抛光机的R Fü晶片6“Durchmesser德..Features.特征。Three phase motor with improved true running..具有改的真实..三相电机Infinitely variable speed of the polishing plate..抛光板..无级变Vacuum system..真空系统。Centering nut enables fast exchange of polishing pad..定心母使抛光垫的快交换的..Slurry feeding..泥..Wafer centering by roller system.晶圆定心系统。Rotating polishing chucks旋抛光卡盘
