Super finishing of mono poly-crystalline silicon blocks for solar wafer.级单多晶硅块太硅片加工。High precision flat grinding machine with oscillating table and two spindles..精密平研磨机与振动台和两..Prepared for robot-loading of block.准备加块机器人。Main grinding spindle with combiwheel D46/D15.combiwheel d46 / D15与磨床主。Second grinding spindle for simultaneously camferring the edges of the block..同时camferring块的缘二砂主..chamferring of the edges and grinding of the faces in the same clamping position (no rechucking).chamferring的和在同一夹紧位置磨无半模型。Automatic handling (loading, unloading, turning) of the block..动处理加卸削的块。Automatic grinding process动磨削程
