10-3170是一种单组分热固化环氧体系。 不像多环氧体系的一分是可以治愈10-3170在度的低温。 由于它够在低温下固化系统可应用在温度的地方固化系统是禁止的各种应用。
One Component Epoxy — 10-3170
10-3170 is a one component heat curing epoxy system. Unlike many one part epoxy systems, 10-3170 can be cured at moderately low temperatures. Due to its ability to cure at low temperatures, this system can be utilized in numerous applications where higher temperature curing systems were prohibited.
技术参数/Specifications
| Type | High Dielectric |
| Form / Function | Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Liquid |
| Material System | |
| Chemical System | Epoxy |
| Composition | Unfilled |
| Cure / Technology | Thermoset; Single Component |
| Composition & Features | |
| Industry | Electronics; OEM or Industrial |
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