Epoxy Adhesive & Potting Compound — 10-3009

Epoxy Adhesive & Potting Compound -- 10-3009 Epoxies Etc...

10-3009是一种低粘度环氧树粘剂和灌封料。 它易于使用并允最终用户整固化环氧树的灵活性。 产品提供了剥离和拉伸强度的好结合。 10-3009提供电气绝缘性和出的着力。

10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and outstanding adhesion.

技术参数/Specifications

Electrical 
Dielectric Strength 2.17E7
Dielectric Constant 3.11
Form Adhesives; Potting Compound
Material Thermoset or RTV; Two Component or Catalyst Cured; Epoxy
Features Electronics / Semiconductors

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