40-3904是一种二组分方在室温下固化。 它也可以很快治愈度发热。 40-3904已为便于应用水平低的离子优的导电性低出毒气变性。 它也以其出的化学性。
Microelectronic Grade Epoxy — 40-3904
40-3904 is a two component formulation designed to cure at room temperature. It may also be quickly cured with mild heat. The 40-3904 has low levels of ions, excellent electrical conductivity, low out gassing, and high thixotropy for ease of application. It is also known for its outstanding chemical resistance.
技术参数/Specifications
| Compound Type | Electrically Conductive Compound |
| Material Form | Die Bonding Adhesives; Liquid |
| Industry | Electronics (PCB / SMT Assembly) |
| Chemical System | Epoxy |
| Filler | Unfilled Resin, Base Polymer or Neat Resin |
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