20-3003是一种低粘度灌封封和粘接系统。 它的低粘度允好的流动性和基材润湿。
Epoxy Potting and Adhesive System — 20-3003
20-3003 is a low viscosity, potting, encapsulating, and adhesive system. Its low viscosity allows for good flow and wetting of substrates.
技术参数/Specifications
| Material Form | Die Bonding Adhesives; Encapsulant, Potting Compound; Liquid |
| Industry | Electronics (PCB / SMT Assembly) |
| Chemical System | Epoxy |
| Filler | Unfilled Resin, Base Polymer or Neat Resin |
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