20-3300是一个两分环氧系统方以满最关的电子封的求。 系统具有低收缩率抗拉和抗压强度。
20-3300是一个两分环氧系统方以满最关的电子封的求。 系统具有低收缩率抗拉和抗压强度。
20-3300 is a two part epoxy system formulated to meet the most critical electronic encapsulating requirements. This system has low shrinkage, high tensile and compressive strength.
Chemical System | Epoxy |
Type / Form | Liquid |
Composition | Unfilled |
Cure / Technology | Thermoset; Two Component |
Features | Encapsulant, Potting Compound |
Industry | Electronics |
温和热冲击环氧-20-3300,环氧树等。,特种粘剂,密封剂和化合物,High Temperature and Thermal Shock Epoxy , 20-3300, Epoxies Etc…, Specialty Adhesives, Sealants and Compounds
Epoxies高温环氧胶