环氧树等的树用于保护离并瞒电元件和备。 些方旨在满灌封多刻的求封并投在电子电器汽和空天等业应用。
Low Density Rigid Polyurethane Foam — 20-2023
Epoxies, Etc’s resins are used to protect, insulate, and conceal circuitry, components, and devices. These formulations were designed to satisfy the requirements of many demanding potting, encapsulating, and casting applications in the electronic, electrical, automotive, and aerospace industries.
技术参数/Specifications
| Type | ClosedCell; Rigid; Foam |
| Form / Shape | Casting Resin |
| Material / Composition | Polymer / Plastic; Elastomer; Polyurethane |
| Material Properties | |
| Density | 2.20 lbs/ft³ |
| Applications | Industrial OEM; Potting; Encapsulating |
| Features & Approvals | Electrical Insulation; Flame or Fire Retardant; Thermal Insulation; UL; UL 94 V-1;0 |
低密度硬氨泡沫-20-2023,环氧树等..,泡沫和泡沫材料,Low Density Rigid Polyurethane Foam , 20-2023, Epoxies Etc…, Foams and Foam Materials