Epoxy Potting & Encapsulating Compound — 20-3006

Epoxy Potting & Encapsulating Compound -- 20-3006 Epoxies Etc...

20-3006是一个独特的两个组件电子级灵活的环氧灌封料。 个系统以提供电绝缘性化学保护和抗热性。 20-3006的灵活性提供了及其他精密的电子元件低应力。 种封和灌封料具有易于一对一的比例混合并DOT危。

20-3006 is a unique two component, electronic grade, flexible epoxy potting compound. This system was engineered to provide electrical insulation, chemical protection, and thermal shock resistance. The flexibility of 20-3006 provides low stress on surface mount and other delicate electronic components. This encapsulating and potting compound has an easy one to one mix ratio, and is D.O.T. non-hazardous.

技术参数/Specifications

Electrical 
Dielectric Constant 3.53
Form Potting Compound
Material Thermoset or RTV; Two Component or Catalyst Cured; Epoxy
Features Electronics / Semiconductors

环氧树灌封及封化合物-20-3006,环氧树等..,电气绝缘材料和绝缘材料,Epoxy Potting & Encapsulating Compound , 20-3006, Epoxies Etc…, Electrical Insulation and Dielectric Materials


Related posts