20-3070是一种双组份灌封和封系统。 个系统包含玻璃球有助于减少热系数。
Epoxy — 20-3070
20-3070 is a two component potting & encapsulating system. This system contains glass spheres which helps minimize the coefficient of thermal expansion.
技术参数/Specifications
| Material Form | Encapsulant, Potting Compound; Liquid |
| Industry | Electronics (PCB / SMT Assembly) |
| Chemical System | Epoxy |
环氧-20-3070,环氧树等..,电气树和电子化合物,Epoxy , 20-3070, Epoxies Etc…, Electrical Resins and Electronic Compounds