Epoxy Potting and Encapsulating Resin — 20-3042

Epoxy Potting and Encapsulating Resin -- 20-3042 Epoxies Etc...

20-3042是一个用的刚性环氧树密封为便于处理。 种低粘度系统具有优的物理热和电气绝缘性。

20-3042 is a general purpose rigid epoxy encapsulant designed for ease in handling. This low viscosity system exhibits excellent physical, thermal, and electrical insulation properties.

技术参数/Specifications

Electrical 
Dielectric Strength 1.81E7
Dielectric Constant 4.10
Form Potting Compound
Material Thermoset or RTV; Two Component or Catalyst Cured; Epoxy
Features Electronics / Semiconductors

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