20-3030是一个空缺低粘度环氧树体系。 系统是专为快流平和易用性。 20-3030有一个方便的2:1的比例混合并在室温下固化。 是一个化学品水和性很好的择。 20-3030具有优的粘接属塑料涂层的导线。
Epoxy Potting and Casting Resin — 20-3030
20-3030 is an unfilled, low viscosity epoxy system. This system was designed for fast, self leveling and ease of use. 20-3030 has a convenient 2:1 mix ratio and will cure at room temperature. It is a good choice for chemical, water and corrosion resistance. 20-3030 also exhibits excellent adhesion to metals, plastic, and coated lead wires.
技术参数/Specifications
| Material Form | Encapsulant, Potting Compound; Liquid |
| Industry | Electronics (PCB / SMT Assembly) |
| Chemical System | Epoxy |
| Filler | Unfilled Resin, Base Polymer or Neat Resin |
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