Beam Imaging Solutions (BIS) introduces the new 90-degree BOS which allows remote imaging of a beam at 90 degrees to the imaging plane. The new BOS-18-IW can be attached to a linear motion feedthrough and placed into and out of the beam allowing for remote imaging, deep within the vacuum chamber. The imaging is accomplished by mounting a standard BOS MCP/phosphor screen stack onto a metal housing which has a mirror mounted at 90-degrees with respect to the imaging plane. The housing is wedged shaped to minimize the physical size of the imager, and has convenient points for attaching to a linear motion feedthrough. Electrical connections are made by attaching flexible electrically insulated wires to a connection block on the wedge from an electrical feedthrough. In their standard form, the BOS-IW units are available with the MCP/phosphor assembly mounted to wedge shaped housing with electrical connection block. BOS-IW kits are also available, and include the BOS-IW unit with electrical feedthrough, viewport, linear motion feedthrough and camera systems.
Imaging Area:
- 18mm Diameter
MCP: (Standard)
- 0.975″ Diam. (BOS-18-IW), 10 micron channel diameter, Imaging Grade
- 18mm active area, 12 micron pitch, 5° Bias Angle, 40:1 Aspect Ratio (Standard, BOS-18-IW)
- Max. Gain: 2 x 104 (single plate, Std.) 1000V > 107 (chevron, OPT-01), 2000V
Phosphor Screen (Standard)
- P-43 with aluminum overcoat. P-43 Peak Wavelength: λ= 545 nm.
Power Supply Requirements:
- 0 – + 1000V, 1mA single MCP (Standard)
- 0 – + 2000V, 1mA dual MCP (OPT-01)
- 0 – + 5000V, 1 mA Phosphor Screen
Beam Energy Range:
- 1 eV to over 50 keV
Beam Current Range:
- < 10 μA (with optional beam attenuation grids)
Vacuum: 1 x 10-6 Torr or better required to operate MCP
- UHV compatible, maximum bakeout temperature 300 C
