High precision grinding machine for grinding of non-ferrous material and semiconductor material.精度磨床用于磨削有属材料和半导体材料。Application.应用。The MPS RC Vacuum is designed for economic grinding silicon wafer up to 8″ diameter and other semiconductor material, special hard and brittle material, e.g. SiC, sapphire.MPS RC真空是专为经济磨硅片到8”直径和其他半导体材料特殊的硬材料如碳化硅宝石。Characteristic.特征。Wafer grinder with vertical grinding spindle and diamond cup grinding wheel; combined motor grinding spindle 3,3 kW; high precision infeed system with two phases stepping motor and free programmable infeed speed; minimal step 1µm; rotary table speed infinitely variable between 2 and 30 rpm.垂直主和刚石砂晶圆磨床组合电机磨削主3,3千瓦精度给系统的两段步电机和可由编程给度最小步1µm盘无级变2和30 rpm之。
