50-3185是一个填充环氧密封剂具有优异的物理电气和热性。 50-3185是一个很好的择在低的热优异的电气绝缘和/或导热性是必的。 三种催化剂可供择。
Thermally Conductive Resin — 50-3185 Catalyst #105
50-3185 is a filled epoxy encapsulant possessing excellent physical, electrical, and thermal properties. 50-3185 is an excellent choice where low thermal expansion, outstanding electrical insulation and/or high thermal conductivity is required. Three catalysts are available to choose from.
技术参数/Specifications
| Electrical | |
| Dielectric Strength | 1.46E7 |
| Dielectric Constant | 5.41 |
| Form | Potting Compound |
| Material | Filled Resin or Composite Material; Thermoset or RTV; Two Component or Catalyst Cured; Epoxy |
| Features | Electronics / Semiconductors |
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