20-2366 FR是一种新的热传导性氨灌封料。 种灵活的系统是专为低应力敏感元件中后治愈。 20-2366燃氨树体系制定用于低放热低收缩率优异的电性和应用。
Thermally Conductive PU Potting Compound — 20-2366FR
20-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 20-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties.
技术参数/Specifications
| Type | Thermally Conductive |
| Material System | |
| Chemical System | Polyurethane; Elastomeric |
| Composition | Unfilled |
| Cure / Technology | Thermoset; Two Component ; Room Temperature Vulcanizing or Curing |
| Form / Shape | Liquid |
| Composition & Features | |
| Industry | Electronics |
| Features | Flame Retardant; Flexible; UL Rating |
导热PU灌封料-202366FR,环氧树等。,导电和化合物,Thermally Conductive PU Potting Compound , 20-2366FR, Epoxies Etc…, Conductive Adhesives and Compounds