20-2353是一种低硬度氏A 50灌封浇和封化合物。 twopart系统以提供电子元器件低应力抵制湿气。 20 – 2353提供了极好的水稳定性低吸湿气低玻璃化变温度低应力敏感元件。
PU Potting & Encapsulating Compound — 20-2353
20-2353 is a low durometer (Shore A 50) potting, casting, and encapsulating compound. This twopart system is engineered to provide low stress on electronic components and to resist moisture. 20- 2353 provides excellent hydrolytic stability, low moisture permeability, a low glass transition temperature, and low stress on sensitive components.
技术参数/Specifications
| Compound Type | Encapsulant, Potting Compound |
| Type / Form | Liquid |
| Cure / Technology | Room Temperature Vulcanizing or Curing; Thermoset; Two Component |
| Features | High Dielectric; Unfilled; Flexible |
| Industry | Electronics |
氨灌封和封化合物-20-2353,环氧树等。,氨粘剂及密封剂,PU Potting & Encapsulating Compound , 20-2353, Epoxies Etc…, Polyurethane Adhesives and Sealants