Potting Compound — 20-3063

Potting Compound -- 20-3063 Epoxies Etc...

20-3063是一种电子级灌封和封化合物。 环氧树系统是专为一种简单经济实惠灌封工应用。 20-3063具有易于使用的或体积一对一的混合比例。 树是和有明产品已妥善白混合在一的催化剂。

20-3063 is an electronic grade potting and encapsulating compound. This epoxy system is designed for applications requiring an easy and affordable potting process. 20-3063 has an easy to use one to one mix ratio by weight or volume. The resin is pigmented black and the catalyst white for a visual indication that the products have been properly mixed together.

技术参数/Specifications

Chemical System Epoxy
Type / Form Liquid
Composition Unfilled
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Features Encapsulant, Potting Compound
Industry Electronics

灌封料-20-3063,环氧树等。,特种粘剂,密封剂和化合物,Potting Compound , 20-3063, Epoxies Etc…, Specialty Adhesives, Sealants and Compounds


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