Polyurethane Potting & Encapsulant — 20-2130

Polyurethane Potting & Encapsulant -- 20-2130 Epoxies Etc...

种氨系统系列是专为电子灌封​​封和的应用。 它们是低粘度毒性低在流TriggerBond ®双桶盒系统。 些弹性体系统是一个用于各种电子绝缘应用。 硬度围从尔A凝可入80。

This series of polyurethane systems is engineered for electronic potting, encapsulating, and casting applications. They are low in viscosity, low in toxicity and available in the popular TriggerBond® dual barrel cartridge dispensing system. These elastomeric systems are suitable for a variety of electronic insulating applications. The durometers range from an enterable gel to Shore A 80.

技术参数/Specifications

Compound Type Encapsulant, Potting Compound
Type / Form Liquid
Substrate Compatibility Composites; Metal; Plastic
Cure / Technology Thermoset; Two Component  
Features Filled
Industry Electronics

氨灌封及密封剂-20-2130,环氧树等。,氨粘剂及密封剂,Polyurethane Potting & Encapsulant , 20-2130, Epoxies Etc…, Polyurethane Adhesives and Sealants


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