50-3105是一种导热灌封和环氧体系。 系统是专为求最刻的电子灌封封和固定应用。 50-3105催化剂时190或105使用的催化剂提供温和化学性。
High Temperature Thermally Conductive — 50-3105
50-3105 is a thermally conductive adhesive and potting epoxy system. This system is engineered for the most demanding electronic potting, encapsulating, and bonding applications. 50-3105 when used with Catalyst 190 or Catalyst 105 provides high temperature and chemical resistance.
技术参数/Specifications
| Compound Type | Thermally Conductive |
| Material Form | Die Bonding Adhesives; Encapsulant, Potting Compound; Liquid |
| Industry | Electronics (PCB / SMT Assembly) |
| Chemical System | Epoxy |
| Filler | Unfilled Resin, Base Polymer or Neat Resin |
温导热-50-3105,环氧树等..,电气树和电子化合物,High Temperature Thermally Conductive , 50-3105, Epoxies Etc…, Electrical Resins and Electronic Compounds