50-3186是一个两分导热环氧粘合剂。 变温债券提供的各种基材。 50-3186是一个导热低工作温度性应用的理想择。
50-3186是一个两分导热环氧粘合剂。 变温债券提供的各种基材。 50-3186是一个导热低工作温度性应用的理想择。
50-3186 is a two part thermally conductive epoxy adhesive. This thixotropic adhesive provides high temperature bonds to a variety of substrates. 50-3186 is a perfect choice for applications requiring high thermal conductivity, low thermal expansion, and high operating temperature performance.
Compound Type | Thermally Conductive |
Material Form | Die Bonding Adhesives; Liquid |
Industry | Electronics (PCB / SMT Assembly) |
Chemical System | Epoxy |
Filler | Unfilled Resin, Base Polymer or Neat Resin |
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Epoxies高温环氧胶