50-2370是一种新的热传导性氨灌封料。 系统是专为低应力敏感元件中后治愈。 它是制定了求低放热低收缩率优异的电性和快5分凝时的应用程序。
50-2370 is a new thermally conductive polyurethane potting compound. This system is designed for low stress on sensitive components during and after cure. It is formulated for applications requiring low exotherm, low shrinkage, excellent electrical properties and a rapid 5 minute gel time.
技术参数/Specifications
| Compound Type | Thermally Conductive |
| Material Form | Encapsulant, Potting Compound; Liquid |
| Industry | Electronics (PCB / SMT Assembly); OEM / Industrial; Semiconductors or Semiconductor Packaging; Surface Mount Components |
| Features | Flame Retardant or UL 94V-0 Rated |
| Chemical System | Polyurethane |
快的凝氨复合-50-2370,环氧树等..,电气树和电子化合物,Fast Gelling Polyurethane Compound , 50-2370, Epoxies Etc…, Electrical Resins and Electronic Compounds