20-3061是100反应性环氧树体系不含有任何溶剂或添加剂级的物理热和电气绝缘性。 是一个充满低粘度系统提供好的流动性和浸润的特点。 20-3061是专为灌封浇并结合应用。
Epoxy Resin System — 20-3061
20-3061 is a 100% reactive epoxy resin system which does not contain any solvents or additives which downgrade physical, thermal, and electrical insulation properties. This is a filled low viscosity system which provides good flow and wet out characteristics. 20-3061 is designed for potting, casting, and bonding applications.
技术参数/Specifications
| Electrical | |
| Dielectric Constant | 4.20 |
| Form | Potting Compound |
| Material | Filled Resin or Composite Material; Thermoset or RTV; Two Component or Catalyst Cured; Epoxy |
| Features | Electronics / Semiconductors |
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