20-3001是一种低粘度填充环氧树灌封和封系统的形式就像完成一个泡沫玻璃时免治愈。
Epoxy Potting and Encapsulating Resin — 20-3001
20-3001 is a low viscosity, unfilled epoxy potting and encapsulating system which forms a bubble free glass like finish when cured.
技术参数/Specifications
| Material Form | Encapsulant, Potting Compound; Liquid |
| Industry | Electronics (PCB / SMT Assembly) |
| Chemical System | Epoxy |
| Filler | Unfilled Resin, Base Polymer or Neat Resin |
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