丹麦tantec公司介绍
我们有超过40年的历史,任何行业的高端表面处理产品的制造经验。Tantec不断为苛刻的实验要求开发新的解决方案。
Tantec集团是一家私人控股公司,成立于1974年,是一家主要为塑料和金属表面提高附着力而生产标准和定制的等离子体和电晕系统的公司。Tantec表面处理系统拥有全世界最多的客户超过30个全球合作伙伴.
Tantec / S是总部位于丹麦的Lunderskov,purpose-build工厂从1989年开始,服务,研发专用机械和高质量的电子表面处理设备。
Tantec EST inc .)是北美分公司,成立于1987年,在芝加哥。
Wimsheim Tantec GmbH,在汉堡,以及生产设备销售和服务办事处,1995年在德国成立。
产品介绍:
Roto VAC真空等离子处理器是专为小型注塑塑料部件设计的,不用把他们放在夹具中或者其他复杂的控制工具。
独特的鼓式设计,只需要将样品放在里面填满,然后仪器的旋转会确保所有的部件表面都会被处理到。
当真空度达到1~4mbar时,真空室中电极会通过等离子体电极放电,处理周期非常短,一般为20~180秒,不同材料和配方时间不同。
该款型号操作简便,性能可靠以及处理速度非常快,处理气体可以是氩气和氧气,但许多情况下由于等离子电极的巨大能量,气氛是非必要的,roto VAC电源为HV-X系列,且有特殊设计的变压器。
FEATURES: | |
Easy to install and use | Connect to mains power and compressed air. |
Fast treatment times | High power impact enables treatment times from 20-180 seconds, depending on material. |
Standard or customised chambers | Chamber and drum size can be designed to most applications. Many available as standard. |
Vacuum level | The plasma discharge is active from 1-4 mbar depending on application. |
Process gas | Process gasses such as oxygen and argon can be used, but in mostcases it is not necessary. |
Process control | The entire plasma process is controlled by the HV-X generator and PLC unit. All parameters are displayed through the touch panel. (Standard – Proface). |
Cost efficient surface treatment | Due to the low power and no need of special treatment gasses the unit is a very cost efficient solution for improving surface wettability and adhesion. |
Vacuum pressure plasma | Enables treatment of both conductive and non-conductive surfaces. |
Technical Specifications | RotoVAC Vacuum Plasma Treater |
Mains voltage and frequency | 230 VAC or 480 VAC 3Ph. |
Output voltage/plasma power | Max. 400 Vp/max. 2000 Watt |
Power supply | HV-X plasma generator series |
Compressed air inlet | 5–6 bar dry and clean |
Process gas | Standard: air, oxygen, argon, nitrogen on request |
Vacuum pump capacity in m³/min. | 15 to 240 m³/min., depending on size of vacuum chamber |
Vacuum level | 1–4 mbar |
Evacuation time, typical | 15-60 seconds, depending on chamber size and pump capacity |
Plasma treatment time, typical | 20–180 seconds, depending on material |
Control and connectivity | Complete with touch panel. (Standard – Proface) |
Regulation compliance | CE – RoHs – WEEE |