EP21-1

硕士邦德高分子胶粘剂EP21TDC是一种二组分通用配方，固化在室温下或在高温下更迅速地粘接环氧树脂粘合剂，以一比一的比例混合，重量或体积。 它易于开发了2800多个在室温下PSI它不像其他许多环氧粘合剂，是相对不敏感，混合比或基板清洗程序粘接强度高。 该EP21TDC环氧树脂体系还具有非常高的剥离强度后，室温固化。 它产生持久的高强度的，哪些是显着的抗热循环和包括水，油和有机溶剂的化学品最艰难的铸件，在-100 ° F极宽的温度范围超过250 ° F。 粘附于金属，玻璃，陶瓷，木材，橡胶硫化和许多塑料是非常好的。 硬化胶是一种绝缘体。 部分颜色清晰，B部分琥珀。 硕士邦德EP21TDC胶粘剂被广泛应用于电子，电气，计算机，建筑，金属加工，家电，汽车，化工等行业。 非滴版本，EP21TDCND也可，以及更快的固化版本称为EP21TDCF3。 固化后的胶粘剂完全符合MIL – A – 81236（OS），MMM – A – 134 – 1型的要求。

Master Bond Polymer Adhesive EP21TDC is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 2800 psi at room temperature which unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. The EP21TDC epoxy resin system furthermore features very high peel strength after room temperature cure. It produces durable high strength and tough castings which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -100°F to more than 250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. Color of part A clear, part B amber. Master Bond EP21TDC adhesive is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries. A non-drip version, EP21TDCND is also available, as well as a faster curing version called EP21TDCF3. The cured adhesive fully meets the requirements of MIL-A-81236 (OS), MMM-A-134-Type 1.