丹麦tantec公司介绍
我们有超过40年的历史,任何行业的高端表面处理产品的制造经验。Tantec不断为苛刻的实验要求开发新的解决方案。
Tantec集团是一家私人控股公司,成立于1974年,是一家主要为塑料和金属表面提高附着力而生产标准和定制的等离子体和电晕系统的公司。Tantec表面处理系统拥有全世界最多的客户超过30个全球合作伙伴.
Tantec / S是总部位于丹麦的Lunderskov,purpose-build工厂从1989年开始,服务,研发专用机械和高质量的电子表面处理设备。
Tantec EST inc .)是北美分公司,成立于1987年,在芝加哥。
Wimsheim Tantec GmbH,在汉堡,以及生产设备销售和服务办事处,1995年在德国成立。
产品介绍:
Syrin tec是专为PP或者PE材质的注射器管筒进行360°电晕处理的系统,一般安装在最后一道印刷工序之前的生产线中。
通过电晕放电提高表面润湿性以及附着能力,低表面能的基质常常会导致油墨附着力差。
要获得最佳附着力,有必要使得基板的表面能略高于粘附材料的自由能,通过电晕处理,可得到理想的结果,syrin tec专为PP、PE等材质设计,一般用于注射器管的油墨印刷。
采用高耐用的陶瓷电极,可对针管进行统一处理,有低俗和高速的标准单元,也可根据客户要求定制特定的印刷过程。
FEATURES: | |
Easy to install and use | Connect to mains power and compressed air. |
Fast treatment times | High power impact enables treatment times from 20-180 seconds, depending on material. |
Standard or customised chambers | Chamber and drum size can be designed to most applications. Many available as standard. |
Vacuum level | The plasma discharge is active from 1-4 mbar depending on application. |
Process gas | Process gasses such as oxygen and argon can be used, but in mostcases it is not necessary. |
Process control | The entire plasma process is controlled by the HV-X generator and PLC unit. All parameters are displayed through the touch panel. (Standard – Proface). |
Cost efficient surface treatment | Due to the low power and no need of special treatment gasses the unit is a very cost efficient solution for improving surface wettability and adhesion. |
Vacuum pressure plasma | Enables treatment of both conductive and non-conductive surfaces. |
Technical Specifications | RotoVAC Vacuum Plasma Treater |
Mains voltage and frequency | 230 VAC or 480 VAC 3Ph. |
Output voltage/plasma power | Max. 400 Vp/max. 2000 Watt |
Power supply | HV-X plasma generator series |
Compressed air inlet | 5–6 bar dry and clean |
Process gas | Standard: air, oxygen, argon, nitrogen on request |
Vacuum pump capacity in m³/min. | 15 to 240 m³/min., depending on size of vacuum chamber |
Vacuum level | 1–4 mbar |
Evacuation time, typical | 15-60 seconds, depending on chamber size and pump capacity |
Plasma treatment time, typical | 20–180 seconds, depending on material |
Control and connectivity | Complete with touch panel. (Standard – Proface) |
Regulation compliance | CE – RoHs – WEEE |