Backplane connector / parallel / SMT / high-density 0.075 x 0.75 in | SMASH 背板连接器/并行/ SMT /高密度0.075×0.75 |粉碎
Characteristics
特点
Type:
类型：
backplane
背板
Shape:
形状：
parallel
并行
Connection type:
连接类型：
SMT
SMT
Electrical characteristics:
电气特性：
high-density
高密度
Description
描述
The SMASH offers high robustness where signal integrity is required.
该粉碎提供高鲁棒性的信号完整性是必需的。
Based on an aluminium shell with 1, 2 or 3 bays, the SMASH can house up to 450 contacts. The chevron grid pattern (1.905 x 1.905 [.075 x .75]) provides high contact density for advanced electronics packaging. The shell is equipped with grounding, guide pins, and keying devices to ensure mechanical reliability.
基于铝壳的1，2或3个海湾，粉碎可以容纳450个触点。所提出的网格模式（1.905×075×75×1.905）为先进的电子封装提供高接触密度。外壳配有接地、导向管脚和键控装置，以确保机械可靠性。
Backplane connector / parallel / SMT / high-density 0.075 x 0.75 in | SMASH 背板连接器/并行/ SMT /高密度0.075×0.75 |粉碎