现代电子产品的消水平更的功率比以往任何时候。 传统的板级互常常易安培的电板空用以提或增加在PCB的线或板的厚度。 其他增加入电源电缆电线的数。 安毕业后一™提供了一个力的水平向事会方法。
特点与优势
· RADSOK ®产品最委员会的权力
·事会的权力在小型
·在两种尺寸内置3.6mm70A条和5.7毫米120A条可用
·先的电力备正交卡
·消由纹紧固件板开潜力
毕业后一是°功率散均匀
·无特殊压接工具。 毕业后一™加回流焊工
·标准压接或专用管
·径向孔确保多点的接和效的热Disspation
·电气业务域标准
Modern electronics are consuming higher power levels than ever before. Conventional Board level interconnects often trade board space for higher amperage or increase the thicknesses of copper traces in the PCB or backplane. Other options increase the quantity of the wires in the incoming power cable. Amphenol’s PGY™ provides a method of bringing power horizontally to the board.
Features & Benefits
· RADSOK® Highest Power to Board Product
· High Power to Board in a Small Footprint
· Available in two Sizes, 3.6mm (70A) and 5.7mm (120A)
· Orthogonal Card Edge Power Device
· Eliminates Potential of Cracking Boards from Threaded Fasteners
· Legs of PGY Dissipate High Power Evenly
· No Special Crimp Tools Needed. PGY™ Legs Attach Through a Solder Reflow Process
· Standard Crimp or Application Specific Pins Available
· Radial Socket Design Ensures Multiple Points of Contact and Efficient Heat Disspation
· Silver Plated Electrical Engagement Area Standard
| Applications | Circular / Cylindrical Connectors; Military Connector; High Amp Power Connector |
| Connector Type | Power Connector |
| Gender | Male; Female |
| Termination Types | Crimp (optional feature); Busbar Mount |
| Contacts | |
| Number of Contacts | 1 to 59 |
| Features | Environment Resistant |
| RoHS Compliant | RoHS |
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