PDR PDR IR-C3 Chipmate BGA Rework System 返修台
System Features:
Advanced Focused IR component heating 150W, lens based Focused IR heating with adjustable image system
PDR lens attachments with IR image from 4 to 70mm diameter
Reworks SMDs/ BGAs/QFNs/CSPs + lead free applications
PDR Lens Attachments
F700 (Ø25 - 70mm spot size) standard
Quartz IR PCB preheating High power, medium wave quartz IR
Large area IR PCB preheater system
2000W, single zone (240mm x 240mm heating area)
Handheld Vacuum Placement System
Vacuum operated pick up tool, hand held with silicon cups
Portable Benchtop PCB Workholder
650mm, up to 12” x 10” (300mm x 250mm) PCB capacity
Component Temperature Sensing - Non-contact, IR Sensor
Manually adjustable, K-type non-contact IR sensor, Ø7-10mm spotsize
Real time monitoring of component temperature throughout process
PCB Temperature Sensing Manually attached K-type wire thermocouple
Digital, Closed-loop Electronic Control
Digital programmable controller (20 internal profile storage)
Simple key pad setting power/time/temperature controls
2 Channel component and PCB temperature control
PDR PDR IR-C3 Chipmate BGA Rework System 返修台
询价采购PDR PDR IR-C3 Chipmate BGA Rework System 返修台
请微信扫描下方二维码或手动添加微信号2351992198
